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- EFFICIENT THERMAL CONDUCTIVITY - The thermal conductivity amounts to 1.5 W/mK. The silicone-based thermal pad and a special filler outperform generic and performance pads.
- GAP FILLING - SIZE - 10 x 10 x 1mm, thanks to its low hardness and high compressibility, the thermal pad works as a perfect filler and bridge.
- SAFE HANDLING - The pad contains no metal particles, providing electrical insulation, and would not cause any damage.
- EASY AND QUICK TO APPLY - Installing the thermal pad is a breeze, the ideal filler for high electrical performance, perfect for beginners.
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Main Parameter - Thermal conductivity: 6.5 (W / M-K), Continuous temperature: -50 ℃ ~ 200 ℃, Breakdown voltage: 4KV, Tensile strength: 12Kgf / cm2, Natural adhesiveness.
Feature:
The pad is sticky, with good conduction, it can be easily placed on IC chipsets and heatsinks, and can also be fixed on LED IC SMD DIP or elsewhere.
1. Softness, good malleability, with slight viscosity.
2. Strong insulation and excellent performance.
3. Provides hassle-free installation, maximum heat conduction, and better cooling.
4. Reduces heatsink effectiveness and increases the operating temperature of the processor / video card.
5. With this copper pad to significantly lower GPU temperatures, it can be used for graphics, northbridge, memory chipsets, IC chips.
Color: Blue
Material: Conductive silicone.
Thermal conductivity: 1.5 (W / M-K).
Continuous temperature: -50 ℃ ~ 200 ℃.
Breakdown voltage: 4KV.
Tensile strength: 12Kgf / 2cm.
Small piece: 10 x 10 x 1 mm.
Package includes:
100 pcs thermal pad (10 mm x 10 mm x 1 mm / piece)